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Effect of scanning methods on residual stress distribution during direct laser metal deposition shaping
Kong Y(孔源); Liu WJ(刘伟军); Wang YC(王越超)
作者部门装备制造技术研究室
会议名称2012 2nd International Conference on Frontiers of Manufacturing Science and Measuring Technology, ICFMM 2012
会议日期June 12-13, 2012
会议地点Xi'an, China
会议主办者Control Engineering and Information Science Research Association; Int. Front. Sci. Technol. Res. Assoc.; Trans Tech Publications; Chin-Yi University of Technology
会议录名称Advanced Materials Research
出版者Trans Tech Publications
出版地Clausthal-Zellerfeld, Germany
2012
页码152-158
收录类别EI ; CPCI(ISTP)
EI收录号20122015018924
WOS记录号WOS:000310816200037
产权排序1
ISSN号1022-6680
ISBN号978-3-03785-404-4
关键词Computer Simulation Finite Element Method Manufacture Stress Concentration
摘要In order to improve that quality of sample and decrease the stress during process, it is of great importance to study the residual stress distribution during direct laser metal deposition (LMDS) process. In this paper, according to the "element life and death" technique of finite element method, with APDL, we simulated the effects of long edge reciprocating scanning method, short edge reciprocating scanning method and direction orthogonal changing in different layers reciprocating scanning method to residual stress distribution during whole LMDS process are studied. The residual stress distribution under different scanning methods is researched in detail. Using the same process parameters, the simulation result show good agreement with the features of sample which fabricated by LMDS.
语种英语
引用统计
文献类型会议论文
条目标识符http://ir.sia.cn/handle/173321/10156
专题装备制造技术研究室
作者单位1.Shenyang Institute of Automation, Chinese Academy of Science, Shenyang, China
2.Graduate University of the Chinese Academy of Sciences, Beijing, China
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GB/T 7714
Kong Y,Liu WJ,Wang YC. Effect of scanning methods on residual stress distribution during direct laser metal deposition shaping[C]//Control Engineering and Information Science Research Association; Int. Front. Sci. Technol. Res. Assoc.; Trans Tech Publications; Chin-Yi University of Technology. Clausthal-Zellerfeld, Germany:Trans Tech Publications,2012:152-158.
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