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Atomic force microscope deposition assisted by electric field
Liu ZL(刘增磊); Jiao ND(焦念东); Wang ZD(王志东); Dong ZL(董再励); Liu LQ(刘连庆)
Department机器人学研究室
Conference Name2013 2nd International Conference on Micro Nano Devices, Structure and Computing Systems, MNDSCS 2013
Conference DateJanuary 23-24, 2013
Conference PlaceShenzhen, China
Author of SourceInternational Information Engineering Institute, USA
Source PublicationAdvanced Materials Research
PublisherTrans Tech Publications
Publication PlaceClausthal-Zellerfeld, Germany
2013
Pages69-73
Indexed ByEI
EI Accession number20131616209047
Contribution Rank1
ISSN1022-6680
ISBN978-3-03785-642-0
KeywordAtomic Force Microscopy Electric Fields Electric Properties Field Emission Nanostructured Materials Nanostructures
AbstractThis paper introduces atomic force microscope (AFM) deposition method to fabricate nanostructures and nanodevices. Field emission theory is introduced in this paper, which provides theoretical explanation for AFM deposition. Dot matrixes are fabricated by AFM deposition on three different substrates, Si, Au and GaAs. Differences of deposition on the three substrates are discussed. AFM deposition has many practical applications. For example, AFM deposition can be used to solder nano components together to improve electrical properties of nanodevices. Besides nanosoldering, AFM deposition can also be used in fabrication of nanodevices. Thus AFM deposition is a valuable research field for future massive applications of nanodevices.
Language英语
Document Type会议论文
Identifierhttp://ir.sia.cn/handle/173321/12411
Collection机器人学研究室
Corresponding AuthorLiu ZL(刘增磊)
Affiliation1.State Key Laboratory of Robotics, Shenyang Institute of Automation, Chinese Academy of Sciences, Shenyang 110016, China
2.Graduate University of Chinese Academy of Sciences, Beijing 100049, China
3.Chiba Institute of Technology, Chiba 275-8588, Japan
Recommended Citation
GB/T 7714
Liu ZL,Jiao ND,Wang ZD,et al. Atomic force microscope deposition assisted by electric field[C]//International Information Engineering Institute, USA. Clausthal-Zellerfeld, Germany:Trans Tech Publications,2013:69-73.
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