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一种用于集成电路晶圆烘焙的热板单元
Alternative TitleHot plate unit used for baking IC wafer
刘伟军; 王靖震
Department装备制造技术研究室
Rights Holder中国科学院沈阳自动化研究所
Patent Agent沈阳科苑专利商标代理有限公司 21002
Country中国
Subtype实用新型
Status未缴年费
Abstract本实用新型公开一种用于集成电路晶圆烘焙的热板单元。根据热学原理,在晶圆烘焙的热板单元的盖体内嵌入与热板内特性及排布相同的热丝,同事嵌入温度传感器与热板同步进行温度控制。在热板单元的盖体内嵌入热丝和温度传感器。这样的安排可以大大降低热板上表面的与外界环境进行热传导的热流密度,提高热板表面的温度均匀性。
Other AbstractThe utility model discloses a hot plate unit used for baking an IC (integrated circuit) wafer. According to the thermal theory, hot wires with the same characteristic and distribution as the hot plate, and temperature sensors are embedded in a cover body of a hot plate unit used for baking the wafer, so as to synchronously perform temperature control. According to the utility model, the hot wires and the temperature sensors are embedded in the cover body of the hot plate unit, so the heat conduction between the external environment and the upper surface of the hot plate, namely the heat flow density, is greatly reduced and the temperature evenness of the hot plate surface is improved.
description.patentprioritydataCN20112147399U
PCT Attributes
Application Date2011-05-11
2011-12-14
Date Available2011-12-14
Application NumberCN201120147399.8
Open (Notice) NumberCN202076235U
Language中文
Contribution Rank1
Document Type专利
Identifierhttp://ir.sia.cn/handle/173321/13357
Collection智能产线与系统研究室
Affiliation中国科学院沈阳自动化研究所
Recommended Citation
GB/T 7714
刘伟军,王靖震. 一种用于集成电路晶圆烘焙的热板单元[P]. 2011-12-14.
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