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Alternative TitleLaser measurement marking-off cutting method for big-width plate
甘洪岩; 徐志刚; 昌成刚; 刘勇
Rights Holder中国科学院沈阳自动化研究所
Patent Agent沈阳科苑专利商标代理有限公司 21002
Other AbstractThe invention relates to a plate processing method, in particular to a laser measurement marking-off cutting method for a big-width plate. The method comprises the following steps of: suspending a workpiece to be cut onto a workbench scanning the workpiece by using a camera arranged on a five-axis gantry measurement marking-off cutter to obtain coordinates of the surface characteristics of the workpiece performing difference compensation fitting by using control software to obtain the profile surface of the workpiece performing data comparison between the profile surface and an ideal model automatically generating a marking-off locus conveying the marking-off locus to the five-axis gantry measurement marking-off cutter starting laser marking-off conveying the path coordinates of the laser marking-off to a cutter and after laser marking-off is completed, cutting according to the laser marking-off locus by using the cutter. Due to the adoption of the method disclosed by the invention, three-dimensional processing can be realized, the data characteristics of a three-dimensional surface are acquired automatically, a processing path is generated automatically, high measuring accuracy, high stability, high speed and high consistence are achieved, and a marking-off product is closer to an ideal curved surface.
PCT Attributes
Application Date2010-12-15
Application NumberCN201010589908.2
Open (Notice) NumberCN102528208A
Contribution Rank1
Document Type专利
Recommended Citation
GB/T 7714
甘洪岩,徐志刚,昌成刚,等. 一种大幅面板材的激光测量画线切割方法[P]. 2012-07-04.
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