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一种用于集成电路晶圆烘焙的热板
Alternative TitleWafer-baking hot plate used for integrated circuit
刘伟军; 王靖震
Department装备制造技术研究室
Rights Holder中国科学院沈阳自动化研究所
Patent Agent沈阳科苑专利商标代理有限公司 21002
Country中国
Subtype发明
Status视为撤回
Abstract本发明公开一种用于集成电路晶圆烘焙的热板。在热板中嵌入两组热丝和两组温度传感器。根据目标需要达到的温度通过温度传感器的反馈进行分别控制,使热板边缘部分和中心部分温度一致。克服了在烘焙过程中热板的边缘部分温度低于热板的中心部分弊端。在热板中嵌入两组热丝和温度传感器进行分别控制。通过此方法可以提高热板的温度均匀性。
Other AbstractThe invention discloses a wafer-baking hot plate used for an integrated circuit. Two groups of hot wires and two groups of temperature sensors are embedded in a hot plate. Respective control can be carried out through the feedback of the temperature sensors according to the target temperature needing to be reached, and thus the temperatures at the edge part and the center part of the hot plate can be consistent the defect that the temperature at the edge part of the hot plate is lower than that at the center part of the hot plate during a baking process is overcome the respective control can be carried out by embedding the two groups of the hot wires and the two groups of the temperature sensors in the hot plate and the temperature uniformity of the hot plate can be increased through the method.
PCT Attributes
Application Date2011-05-11
2012-11-14
Application NumberCN201110120400.2
Open (Notice) NumberCN102781123A
Language中文
Contribution Rank1
Document Type专利
Identifierhttp://ir.sia.cn/handle/173321/13375
Collection智能产线与系统研究室
Affiliation中国科学院沈阳自动化研究所
Recommended Citation
GB/T 7714
刘伟军,王靖震. 一种用于集成电路晶圆烘焙的热板[P]. 2012-11-14.
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