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专利名称: 一种用于集成电路晶圆烘焙的热板
其他题名: Wafer-baking hot plate used for integrated circuit
作者: 刘伟军; 王靖震
所属部门: 装备制造技术研究室
专利权人: 中国科学院沈阳自动化研究所
专利代理: 沈阳科苑专利商标代理有限公司 21002
专利国别: 中国
专利类型: 发明
专利状态: 失效(视为撤回)
摘要: 本发明公开一种用于集成电路晶圆烘焙的热板。在热板中嵌入两组热丝和两组温度传感器。根据目标需要达到的温度通过温度传感器的反馈进行分别控制,使热板边缘部分和中心部分温度一致。克服了在烘焙过程中热板的边缘部分温度低于热板的中心部分弊端。在热板中嵌入两组热丝和温度传感器进行分别控制。通过此方法可以提高热板的温度均匀性。
英文摘要: The invention discloses a wafer-baking hot plate used for an integrated circuit. Two groups of hot wires and two groups of temperature sensors are embedded in a hot plate. Respective control can be carried out through the feedback of the temperature sensors according to the target temperature needing to be reached, and thus the temperatures at the edge part and the center part of the hot plate can be consistent the defect that the temperature at the edge part of the hot plate is lower than that at the center part of the hot plate during a baking process is overcome the respective control can be carried out by embedding the two groups of the hot wires and the two groups of the temperature sensors in the hot plate and the temperature uniformity of the hot plate can be increased through the method.
是否PCT专利:
申请日期: 2011-05-11
公开日期: 2012-11-14
专利申请号: CN201110120400.2
公布/公告号: CN102781123A
语种: 中文
产权排序: 1
内容类型: 专利
URI标识: http://ir.sia.cn/handle/173321/13375
Appears in Collections:装备制造技术研究室_专利

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Recommended Citation:
刘伟军,王靖震. 一种用于集成电路晶圆烘焙的热板. CN102781123A. 2012.
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文件名: CN201110120400.2.pdf
格式: Adobe PDF
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