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Alternative TitleWafer-baking hot plate used for integrated circuit
刘伟军; 王靖震
Rights Holder中国科学院沈阳自动化研究所
Patent Agent沈阳科苑专利商标代理有限公司 21002
Other AbstractThe invention discloses a wafer-baking hot plate used for an integrated circuit. Two groups of hot wires and two groups of temperature sensors are embedded in a hot plate. Respective control can be carried out through the feedback of the temperature sensors according to the target temperature needing to be reached, and thus the temperatures at the edge part and the center part of the hot plate can be consistent the defect that the temperature at the edge part of the hot plate is lower than that at the center part of the hot plate during a baking process is overcome the respective control can be carried out by embedding the two groups of the hot wires and the two groups of the temperature sensors in the hot plate and the temperature uniformity of the hot plate can be increased through the method.
PCT Attributes
Application Date2011-05-11
Application NumberCN201110120400.2
Open (Notice) NumberCN102781123A
Contribution Rank1
Document Type专利
Recommended Citation
GB/T 7714
刘伟军,王靖震. 一种用于集成电路晶圆烘焙的热板[P]. 2012-11-14.
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