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一种用于集成电路晶圆烘焙的热板单元
Alternative TitleWafer-baking hot plate unit used for integrated circuit
刘伟军; 王靖震
Department装备制造技术研究室
Rights Holder中国科学院沈阳自动化研究所
Patent Agent沈阳科苑专利商标代理有限公司 21002
Country中国
Subtype发明
Status未缴年费
Abstract本发明公开一种用于集成电路晶圆烘焙的热板单元。根据热学原理,在晶圆烘焙的热板单元的盖体内嵌入与热板内特性及排布相同的热丝,同事嵌入温度传感器与热板同步进行温度控制。在热板单元的盖体内嵌入热丝和温度传感器。这样的安排可以大大降低热板上表面的与外界环境进行热传导的热流密度,提高热板表面的温度均匀性。
Other AbstractThe invention discloses a wafer-baking hot plate unit used for an integrated circuit. According to a thermal principle, a cover body of the wafer-baking hot plate unit is internally embedded with hot wires having the same characteristics and the same distribution in a hot plate, and the temperature control is synchronously carried out together with the hot plate by embedding a temperature sensor. By embedding the hot wires and the temperature sensor in the cover body of the hot plate unit, the heat flow density on the upper surface of the hot plate which is subjected to heat conduction with the external environment can be greatly reduced due to the arrangement, and the temperature uniformity at the surface of the hot plate can be increased.
PCT Attributes
Application Date2011-05-11
2012-11-14
Date Available2014-05-14
Application NumberCN201110120461.9
Open (Notice) NumberCN102781124A
Language中文
Contribution Rank1
Document Type专利
Identifierhttp://ir.sia.cn/handle/173321/13376
Collection智能产线与系统研究室
Affiliation中国科学院沈阳自动化研究所
Recommended Citation
GB/T 7714
刘伟军,王靖震. 一种用于集成电路晶圆烘焙的热板单元[P]. 2012-11-14.
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