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专利名称: 一种用于集成电路晶圆烘焙的热板单元
其他题名: Wafer-baking hot plate unit used for integrated circuit
作者: 刘伟军; 王靖震
所属部门: 装备制造技术研究室
专利权人: 中国科学院沈阳自动化研究所
专利代理: 沈阳科苑专利商标代理有限公司 21002
专利国别: 中国
专利类型: 发明
专利状态: 有效
摘要: 本发明公开一种用于集成电路晶圆烘焙的热板单元。根据热学原理,在晶圆烘焙的热板单元的盖体内嵌入与热板内特性及排布相同的热丝,同事嵌入温度传感器与热板同步进行温度控制。在热板单元的盖体内嵌入热丝和温度传感器。这样的安排可以大大降低热板上表面的与外界环境进行热传导的热流密度,提高热板表面的温度均匀性。
英文摘要: The invention discloses a wafer-baking hot plate unit used for an integrated circuit. According to a thermal principle, a cover body of the wafer-baking hot plate unit is internally embedded with hot wires having the same characteristics and the same distribution in a hot plate, and the temperature control is synchronously carried out together with the hot plate by embedding a temperature sensor. By embedding the hot wires and the temperature sensor in the cover body of the hot plate unit, the heat flow density on the upper surface of the hot plate which is subjected to heat conduction with the external environment can be greatly reduced due to the arrangement, and the temperature uniformity at the surface of the hot plate can be increased.
是否PCT专利:
申请日期: 2011-05-11
公开日期: 2012-11-14
授权日期: 2014-05-14
专利申请号: CN201110120461.9
公布/公告号: CN102781124A
语种: 中文
产权排序: 1
内容类型: 专利
URI标识: http://ir.sia.cn/handle/173321/13376
Appears in Collections:装备制造技术研究室_专利

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Recommended Citation:
刘伟军,王靖震. 一种用于集成电路晶圆烘焙的热板单元. CN102781124A. 2012.
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文件名: CN201110120461.9.pdf
格式: Adobe PDF
文件名: CN201110120461.9授权.pdf
格式: Adobe PDF
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