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Alternative TitleWafer-baking hot plate unit used for integrated circuit
刘伟军; 王靖震
Rights Holder中国科学院沈阳自动化研究所
Patent Agent沈阳科苑专利商标代理有限公司 21002
Other AbstractThe invention discloses a wafer-baking hot plate unit used for an integrated circuit. According to a thermal principle, a cover body of the wafer-baking hot plate unit is internally embedded with hot wires having the same characteristics and the same distribution in a hot plate, and the temperature control is synchronously carried out together with the hot plate by embedding a temperature sensor. By embedding the hot wires and the temperature sensor in the cover body of the hot plate unit, the heat flow density on the upper surface of the hot plate which is subjected to heat conduction with the external environment can be greatly reduced due to the arrangement, and the temperature uniformity at the surface of the hot plate can be increased.
PCT Attributes
Application Date2011-05-11
Date Available2014-05-14
Application NumberCN201110120461.9
Open (Notice) NumberCN102781124A
Contribution Rank1
Document Type专利
Recommended Citation
GB/T 7714
刘伟军,王靖震. 一种用于集成电路晶圆烘焙的热板单元[P]. 2012-11-14.
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File name: CN201110120461.9.pdf
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