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Alternative TitleWafer pre-locating device based on machine vision and method thereof
吴清潇; 欧锦军; 朱枫; 郝颖明; 付双飞; 苗锡奎
Rights Holder中国科学院沈阳自动化研究所
Patent Agent沈阳科苑专利商标代理有限公司 21002
Other AbstractThe invention relates to a wafer pre-locating device based on machine vision and a method thereof. The device comprises a vacuum-absorbing type wafer feeding table, an image collecting and processing unit, a large-format infrared face area light source and a two-dimension micro-motion platform system. The method comprises the steps of feeding wafers, collecting images of the wafers extracting edges fitting circle centers of the wafers and adjusting positions of the wafers. The device and the method avoid damage to the edges of the wafers, and have the advantages of being free of any adjustment and capable of meeting requirements for accurate location of the wafers. Meanwhile, the device is simple in structure, low in cost, and capable of meeting requirements of manufacture of IC equipment for pre-location of the wafers.
PCT Attributes
Application Date2012-01-19
Application NumberCN201210017565.1
Open (Notice) NumberCN103219269A
Contribution Rank1
Document Type专利
Recommended Citation
GB/T 7714
吴清潇,欧锦军,朱枫,等. 基于机器视觉的晶圆预定位装置及方法[P]. 2013-07-24.
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