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Alternative TitleData collection implementation method of semiconductor manufacturing equipment
刘明哲; 徐皑冬; 叶家发; 王亚楠
Rights Holder中国科学院沈阳自动化研究所
Patent Agent沈阳科苑专利商标代理有限公司 21002
Other AbstractThe invention relates to a data collection implementation method of semiconductor manufacturing equipment. The data collection implementation method comprises the steps: respectively building a Web service at a client terminal and an equipment server terminal, enabling a proxy class to be used in Web communication, conducting client safety certification based on a security socket layer, defining a SOAPHeader data format, building an equipment information database, using an agent entrustment mode to process various abnormal events in the equipment, building a state machine of a data collection plan, achieving behavior conversion on the data collection plan, and using a COM assembly to complete connection between the equipment terminal and an equipment control system. According to the data collection implementation method, a general equipment data collection method is provided for semiconductor manufacturing, and the data collection capacity between a producer and the equipment in a plant in semiconductor production and manufacturing is improved.
PCT Attributes
Application Date2012-06-12
Application NumberCN201210193136.X
Open (Notice) NumberCN103491059A
Contribution Rank1
Document Type专利
Recommended Citation
GB/T 7714
刘明哲,徐皑冬,叶家发,等. 面向半导体制造设备的数据采集实现方法[P]. 2014-01-01.
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