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题名: Research on discharge signals feature extraction of sealing packaging food existing pinholes based on EEMD
作者: Zhang Q(张倩) ; Zhang SG(张善耕) ; Ma Y(马钺)
作者部门: 智能检测与装备研究室
会议名称: 2013 International Conference on Sensors, Mechatronics and Automation, ICSMA 2013
会议日期: December 24-25, 2013
会议地点: Shenzhen, China
会议主办者: et al; Hong Kong Industrial Technology Research Centre; Inha University; Korea Maritime University; National Chengchi University, Taiwan; Queensland University of Technology
会议录: Applied Mechanics and Materials
会议录出版者: Trans Tech Publications
会议录出版地: Zurich-Durnten, Switzerland
出版日期: 2013
页码: 361-365
收录类别: CPCI(ISTP) ; EI
ISSN号: 1660-9336
ISBN号: 9783038350170
关键词: Feature extraction ; Sensors
摘要: The issue of food safety is increasingly becoming the focus of social concerns, and breakage of packaging film is the main threat to the safety of sealing packaging food. For the small damage that is difficult to see with the naked eyes, according to that the impedance of damaged position is different from that of other position, the discharge signals of sealing packaging food in different damaged conditions are different in high voltage dielectric barrier discharge circuit, and then they are collected and analyzed. In order to solve the problem that different discharge signals are similar and characteristics are confused, wavelet packet and the EEMD method are novelly used to analyze discharge signals and the characteristic parameters of sealing packaging food that is intact or has pinholes are successfully extracted. This method solves the problem that the tiny damage is difficult to identify and detect, and it also provides a new train of thought for online test of sealing packaging food.
产权排序: 1
内容类型: 会议论文
URI标识: http://ir.sia.cn/handle/173321/14565
Appears in Collections:智能检测与装备研究室_会议论文

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