To achieve the purpose of lab-on-a-chip device，the integrated metal microelectrode has been becoming one of the essential compositions of microfluidic chips. To solve this problem，it has studied the fracture behavior of the integrated metal microelectrode by the technique of fractography analysis. Multiple preparation method of fracture is discussed and the ideal fracture specimens are prepared with sophisticated automatic wheel dicing mechanism. believing that the fracture is due to shear cut ductile fracture. Fracture of specimen shows typical dimple structure，believes that the electrode has loaded shear stress and tensile stress during the thermal bonding process. the fracture mechanism of the copper film microelectrode is typical dimple ductile fracture，and the higher thermal bonding temperature led to the fracture is believed.