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Single Cu nanowire assembled by microdroplet dielectrophoresis on ultrahigh tensible microelectrodes
Huang CL(黄超雷); Zeng HJ(曾鸿江); Tian XJ(田孝军); Liu J(刘杰); Dong ZL(董再励); Li T(李铁); Wang YL(王跃林)
作者部门机器人学研究室
关键词Single Nanowire Assembly Microdroplet Dielectrophoresis Ultrahigh Tensible Microelectrode Dynamic Tensile Properties Atomic Chain
发表期刊CHINESE SCIENCE BULLETIN
ISSN1001-6538
2014
卷号59期号:5-6页码:577-584
收录类别SCI
WOS记录号WOS:000331563100017
产权排序1
资助机构National Natural Science Foundation of China [51375477, 61375091]; CAS FEA International Partnership Program for Creative Research Teams
摘要At present, study on dynamic tensile properties and atomic chain fabrication of single nanowire, for understanding its dynamic tensile properties and unique physical properties of atomic chain to fabricate atom scale devices, is one of frontier research issues in nanoscale science. However, how to assemble single nanowire on a tensible microstructure becomes one of the most difficult problems, which severely restricts the development of this research field. In this paper, after the ultrahigh tensible microelectrode chip is fabricated by MEMS technology, hexamethyldisilazane is utilized to improve hydrophobicity of the chip, and then a microdroplet dielectrophoresis experimental platform and technology is developed to assemble single nanowire on the sensible microelectrode. Experimental results show that accurate and efficient assembly of single Cu nanowire is realized, which contribute greatly to the further research of dynamic tensile properties and atomic chain fabrication. And for guiding the assembly experiments, finite element technology is also utilized to analyze the local microelectro field around the microelectrodes during dieletrophoresis experiments.
语种英语
WOS标题词Science & Technology
WOS类目Multidisciplinary Sciences
关键词[WOS]COPPER NANOWIRES ; QUANTUM DOTS ; DEVICES ; SCALE
WOS研究方向Science & Technology - Other Topics
引用统计
被引频次:1[WOS]   [WOS记录]     [WOS相关记录]
文献类型期刊论文
条目标识符http://ir.sia.cn/handle/173321/14729
专题机器人学研究室
通讯作者Tian XJ(田孝军)
作者单位1.State Key Laboratory of Robotics, Shenyang Institute of Automation, Chinese Academy of Sciences, Shenyang, China
2.University of Chinese Academy of Sciences, Beijing, China
3.Science and Technology on Micro-system Laboratory and State Key Laboratories of Transducer Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, China
推荐引用方式
GB/T 7714
Huang CL,Zeng HJ,Tian XJ,et al. Single Cu nanowire assembled by microdroplet dielectrophoresis on ultrahigh tensible microelectrodes[J]. CHINESE SCIENCE BULLETIN,2014,59(5-6):577-584.
APA Huang CL.,Zeng HJ.,Tian XJ.,Liu J.,Dong ZL.,...&Wang YL.(2014).Single Cu nanowire assembled by microdroplet dielectrophoresis on ultrahigh tensible microelectrodes.CHINESE SCIENCE BULLETIN,59(5-6),577-584.
MLA Huang CL,et al."Single Cu nanowire assembled by microdroplet dielectrophoresis on ultrahigh tensible microelectrodes".CHINESE SCIENCE BULLETIN 59.5-6(2014):577-584.
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