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Alternative TitleThree-dimensional reconstruction method for internal defect of alloy firmware
赵大威; 赵怀慈; 郝明国; 赵春阳; 周雷
Rights Holder中国科学院沈阳自动化研究所
Patent Agent沈阳科苑专利商标代理有限公司 21002
Other AbstractThe invention relates to a three dimensional reconstruction method for internal defect of an alloy firmware, which comprises the following steps: using a nondestructive test device to generate an infrared image in the infrared image, carrying out nondestructive test on the internal defect of the alloy firmware by a nondestructive test technology, determining the position scope of the defect and the color difference information according to the defect position scope, determining the depth information of a random defect point by combining a heat transfer theory according to the defect position scope and the depth information, completing the three-dimensional reconstruction through a visualization technology for realizing the three-dimensional simulation of the defect. According to the invention, the three-dimensional simulation is carried out for the internal defect of the alloy firmware, thereby the three-dimensional image of the internal defect can be presented in a visual and effective mode. The internal defect condition of the alloy firmware can be detected by the method, the firmware can not be damaged, the technicians can conveniently observe the three-dimensional image of the internal defect of the firmware from multi-direction and multi-level aspects. The method of the invention has important reality meaning and research value.
PCT Attributes
Application Date2010-12-03
Date Available2014-04-09
Application NumberCN201010572548.5
Open (Notice) NumberCN102486462B
Contribution Rank1
Document Type专利
Recommended Citation
GB/T 7714
赵大威,赵怀慈,郝明国,等. 一种合金固件内部缺陷三维重建方法[P]. 2012-06-06.
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