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Research on PVDF micro-force sensor
Ma CZ(马超哲); Du JS(杜劲松); Liu YY(刘意杨)
作者部门智能检测与装备研究室
会议名称4th International Conference on Frontiers of Manufacturing Science and Measuring Technology, ICFMM 2014
会议日期June 19-20, 2014
会议地点Guilin, China
会议主办者Academy Publisher; CEIS; et al; INDERSCIENCE Publishers; TMS; Trans Tech publications inc.
会议录名称Applied Mechanics and Materials
出版者Trans Tech Publications Ltd
出版地Zurich-Durnten, Switzerland
2014
页码1135-1138
收录类别EI
EI收录号20143618135735
产权排序1
ISSN号1660-9336
ISBN号978-3-03835-192-4
关键词Manufacture Micromachining Piezoelectricity Signal Processing
摘要At present, sub-micro-Newton (sub-μN) micro-force in micro-assembly and micro-manipulation is not able to be measured reliably. The piezoelectric micro-force sensors offer a lot of advantages for MEMS applications such as low power dissipation, high sensitivity, and easily integrated with piezoelectric micro-actuators. In spite of many advantages above, the research efforts are relatively limited compared to piezoresistive micro-force sensors. In this paper, Sensitive component is polyvinylidene fluoride (PVDF) and the research object is micro-force sensor based on PVDF film. Moreover, the model of micro-force and sensor's output voltage is built up, signal processing circuit is designed, and a novel calibration method of micro-force sensor is designed to reliably measure force in the range of sub-μN. The experimental results show the PVDF sensor is designed in this paper with sub-μN resolution. © (2014) Trans Tech Publications, Switzerland.
语种英语
文献类型会议论文
条目标识符http://ir.sia.cn/handle/173321/15136
专题智能检测与装备研究室
作者单位1.Key Laboratory of Liaoning Province on Radar System and Application, Shenyang Institute of Automation, Chinese Academy of Sciences, Shenyang 110016, China
2.University of Chinese Academy of Sciences, Beijing 100049, China
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Ma CZ,Du JS,Liu YY. Research on PVDF micro-force sensor[C]//Academy Publisher; CEIS; et al; INDERSCIENCE Publishers; TMS; Trans Tech publications inc.. Zurich-Durnten, Switzerland:Trans Tech Publications Ltd,2014:1135-1138.
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