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Research on PVDF micro-force sensor
Ma CZ(马超哲); Du JS(杜劲松); Liu YY(刘意杨)
Conference Name4th International Conference on Frontiers of Manufacturing Science and Measuring Technology, ICFMM 2014
Conference DateJune 19-20, 2014
Conference PlaceGuilin, China
Author of SourceAcademy Publisher; CEIS; et al; INDERSCIENCE Publishers; TMS; Trans Tech publications inc.
Source PublicationApplied Mechanics and Materials
PublisherTrans Tech Publications Ltd
Publication PlaceZurich-Durnten, Switzerland
Indexed ByEI
EI Accession number20143618135735
Contribution Rank1
KeywordManufacture Micromachining Piezoelectricity Signal Processing
AbstractAt present, sub-micro-Newton (sub-μN) micro-force in micro-assembly and micro-manipulation is not able to be measured reliably. The piezoelectric micro-force sensors offer a lot of advantages for MEMS applications such as low power dissipation, high sensitivity, and easily integrated with piezoelectric micro-actuators. In spite of many advantages above, the research efforts are relatively limited compared to piezoresistive micro-force sensors. In this paper, Sensitive component is polyvinylidene fluoride (PVDF) and the research object is micro-force sensor based on PVDF film. Moreover, the model of micro-force and sensor's output voltage is built up, signal processing circuit is designed, and a novel calibration method of micro-force sensor is designed to reliably measure force in the range of sub-μN. The experimental results show the PVDF sensor is designed in this paper with sub-μN resolution. © (2014) Trans Tech Publications, Switzerland.
Document Type会议论文
Affiliation1.Key Laboratory of Liaoning Province on Radar System and Application, Shenyang Institute of Automation, Chinese Academy of Sciences, Shenyang 110016, China
2.University of Chinese Academy of Sciences, Beijing 100049, China
Recommended Citation
GB/T 7714
Ma CZ,Du JS,Liu YY. Research on PVDF micro-force sensor[C]//Academy Publisher; CEIS; et al; INDERSCIENCE Publishers; TMS; Trans Tech publications inc.. Zurich-Durnten, Switzerland:Trans Tech Publications Ltd,2014:1135-1138.
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