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Scheduling method for single-arm multi-cluster tools with residency time constraints
Hu JT(胡静涛); Li, Linying
Department信息服务与智能控制 技术研究室
Conference Name2015 IEEE International Conference on Cyber Technology in Automation, Control, and Intelligent Systems (CYBER)
Conference DateJune 8-12, 2015
Conference PlaceShenyang, China
Source Publication2015 IEEE International Conference on Cyber Technology in Automation, Control, and Intelligent Systems (CYBER)
PublisherIEEE
Publication PlacePiscataway, NJ, USA
2015
Pages1574-1578
Indexed ByEI ; CPCI(ISTP)
EI Accession number20161402187730
WOS IDWOS:000380502300287
Contribution Rank1
ISSN2379-7711
ISBN978-1-4799-8730-6
KeywordSemiconductor Manufacutory Multiple-cluster Tools Residency Time Cosntraints Buffer/process Mudules Single-arm Robot Scheduling Analysis
AbstractIn semiconductor manufacturing, the throughout analysis and robot action sequence are crucial for multi-cluster tools scheduling problems. This paper studies a general robot scheduling problem for multi-cluster tools with the single-arm robot and buffer process modules. Firstly, the scheduling model with constraints of processing module and robots transport is addressed. Secondly, the lower bound of cycle time is theoretically proved. And based on decomposition idea, the heuristic scheduling method, which produces robot action sequence by virtue of random processing time and cycle time, is proposed. Finally, the superiority of the proposed method is proved simulation results.
Language英语
Citation statistics
Document Type会议论文
Identifierhttp://ir.sia.cn/handle/173321/17670
Collection信息服务与智能控制技术研究室
Affiliation1.Department of Information Service and Intelligent Control Technology, Shenyang Institute of Automation, Chinese Academy of Sciences, Shenyang, Liaoning Province, China
2.School of Software, Dalian University of Foreign Languages, Dalian, Liaoning Province, China
Recommended Citation
GB/T 7714
Hu JT,Li, Linying. Scheduling method for single-arm multi-cluster tools with residency time constraints[C]. Piscataway, NJ, USA:IEEE,2015:1574-1578.
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