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题名: Interface sensing and cutting of ultra-thin film based on UV-assisted AFM
作者: Shi JL(施佳林); Liu LQ(刘连庆)
作者部门: 机器人学研究室
会议名称: 15th IEEE International Conference on Nanotechnology, IEEE-NANO 2015
会议日期: July 27-30, 2015
会议地点: Rome, Italy
会议主办者: Nanotechnology Council
会议录: IEEE-NANO 2015 - 15th International Conference on Nanotechnology
会议录出版者: IEEE
会议录出版地: Piscataway, NJ, USA
出版日期: 2015
页码: 971-974
收录类别: EI ; CPCI(ISTP)
ISBN号: 978-1-4673-8155-0
关键词: atomic force microscopy ; ultrasonic vibration ; nanomchining ; ultra-thin film ; interface/material sensing
摘要: Ultrasonic vibration (UV)-assisted method, as an innovative nanomachining technology, has competitive advantages compared to traditional atomic force microscopy (AFM) nanomachining methods. However, the UV-assisted machining process by AFM is still an open loop control method for cutting depth and sample mechanical properties. Furthermore, the real-time material/interface sensing is still absent when cutting on ultra-thin film. Detection method of machining object (thin film or substrate) remains an obstacle for AFM machining. Here we introduce an ultra-thin film interface sensing and cutting method based on UV-assisted AFM to realize the material/interface detection on the process of nano-machining. This new approach for sensing and cutting ultra-thin film is validated by our experimental results conducting on ultra-thin films with different thickness at nanoscale.
语种: 英语
产权排序: 1
WOS记录号: WOS:000380515200160
Citation statistics:
内容类型: 会议论文
URI标识: http://ir.sia.cn/handle/173321/18612
Appears in Collections:机器人学研究室_会议论文

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Recommended Citation:
Shi JL,Liu LQ. Interface sensing and cutting of ultra-thin film based on UV-assisted AFM[C]. 见:15th IEEE International Conference on Nanotechnology, IEEE-NANO 2015. Rome, Italy. July 27-30, 2015.
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文件名: Interface sensing and cutting of ultra-thin film based on UV-assisted AFM.pdf
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