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A novel approach for preparation of CuO nanostructures on conductive substrate
Wei FN(魏发南); Tao, Quan; Li GY(李广勇); Liu LQ(刘连庆)
作者部门机器人学研究室
会议名称10th IEEE Nanotechnology Materials and Devices Conference, NMDC 2015
会议日期September 12-16, 2015
会议地点Anchorage, AK, United states
会议录名称2015 IEEE Nanotechnology Materials and Devices Conference, NMDC 2015
出版者IEEE Computer Society
出版地Washington, DC
2015
页码1-4
收录类别EI ; CPCI(ISTP)
EI收录号20162102412355
WOS记录号WOS:000380447300038
产权排序1
ISBN号978-1-4673-9362-1
关键词Copper Oxide Solution Process Nanoplate Nanonetwork
摘要

With great potential in various applications including nano-electronics, photovoltaic, sensor, copper oxide with nanostructures are extensively studied in the past decade. Herein, using facile solution process, we prepared uniform copper oxide nanostructures on various substrates, from gold thin film to indium-tin oxide. As we demonstrated, the synthesized structures have a considerably strong dependence on the reaction agent used. Copper chloride, copper nitrite, copper acetate and copper sulfite have been adopted as reaction agents. A type of uniform nano-network structure was acquired when copper sulfite is used. Besides the agent, reaction time also plays an important role in dictating the final structures of copper oxide. Finally, the fundamental mechanism of nanostructure growth was investigated and discussed. These uniform copper oxide nanostructures prepared on substrates are promising in electronic applications at nanoscale.

语种英语
引用统计
文献类型会议论文
条目标识符http://ir.sia.cn/handle/173321/18656
专题机器人学研究室
通讯作者Li GY(李广勇); Liu LQ(刘连庆)
作者单位1.State Key Laboratory of Robotics, Shenyang Institute of Automation, Chinese Academy of Sciences, Shenyang, 110016, China
2.University of Chinese Academy of Sciences, Beijing, 100049, China
3.Department of Electrical and Computer Engineering, University of Pittsburgh, Pittsburgh, 15261, United States
推荐引用方式
GB/T 7714
Wei FN,Tao, Quan,Li GY,et al. A novel approach for preparation of CuO nanostructures on conductive substrate[C]. Washington, DC:IEEE Computer Society,2015:1-4.
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