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Real-Time Data Acquisition Support for IEC 61499 based Industrial Cyber-Physical Systems
Huang, Wanqi1; Dai, Wenbin1; Wang P(王鹏)2; Vyatkin, Valeriy3
作者部门工业控制网络与系统研究室
会议名称IECON 2017: 43rd Annual Conference of the IEEE Industrial Electronics Society (IES)
会议日期October 29 - November 1, 2017
会议地点Beijing, China
会议主办者IEEE Industrial Electronics Society
会议录名称Proceedings of the 43rd Annual Conference of the IEEE Industrial Electronics Society (IECON 2017)
出版者IEEE
出版地New York
2017
页码6689-6694
收录类别EI ; CPCI(ISTP)
EI收录号20182005192246
WOS记录号WOS:000427164806096
产权排序2
ISSN号1553-572X
ISBN号978-1-5386-1127-2
关键词Industrial Cyber-Physical Systems IEC 61499 Function Blocks Real-Time Data Acquisition Management Commands XML Publish-Subscribe Client-Server
摘要Industrial Cyber-Physical Systems enhance physical devices with control, computing and communication abilities to provide smart solutions for industrial applications. In industrial applications, data acquisition is an important topic. Based on feedback data from sensors and equipment, industrial processes could be optimized either by experienced engineers manually or smart agents automatically. The IEC 61499 standard is designed for modeling distributed automation systems that perfectly fits the scope of industrial CPS. However, real-time data acquisition is not supported by the IEC 61499 standard currently. In this paper, an extension to IEC 61499 compliance profile is proposed to support real-time data acquisition. Both client/server and peer-to-peer model are supported. The proposed extension is demonstrated using a demo car manufacturing line.
语种英语
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文献类型会议论文
条目标识符http://ir.sia.cn/handle/173321/22070
专题工业控制网络与系统研究室
通讯作者Huang, Wanqi
作者单位1.Shanghai Jiao Tong University, China;
2.Shenyang Institute of Automation, Chinese Academy of Science;
3.Luleå University of Technology, Sweden and Aalto University, Finland
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GB/T 7714
Huang, Wanqi,Dai, Wenbin,Wang P,et al. Real-Time Data Acquisition Support for IEC 61499 based Industrial Cyber-Physical Systems[C]//IEEE Industrial Electronics Society. New York:IEEE,2017:6689-6694.
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