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Fabrication of Three-dimensional Conductive Structures Using Direct Ink Writing
Yang, Zhiwen1,2; Yu HB(于海波)2; Zhou PL(周培林)2; Wang JY(王敬依)2; Liu LQ(刘连庆)2
Department机器人学研究室
Conference Name7th IEEE Annual International Conference on CYBER Technology in Automation, Control, and Intelligent Systems, CYBER 2017
Conference DateJuly 31 - August 4, 2017
Conference PlaceHawaii, USA
Author of SourceIEEE Robotics and Automation Society
Source Publication2017 IEEE 7th Annual International Conference on CYBER Technology in Automation, Control, and Intelligent Systems, CYBER 2017
PublisherIEEE
Publication PlaceNew York
2017
Pages1562-1565
Indexed ByEI ; CPCI(ISTP)
EI Accession number20183905873489
WOS IDWOS:000447628700282
Contribution Rank1
ISBN978-1-5386-0489-2
Keyword3d Printing Diw Flexible Mems Sensors
Abstract

With the rapid development of wearable devices, the demand of flexible electronics are growing. It requires promoting the innovation of manufacturing method for the flexible electronic device. In this paper, we propose a 3D printing method based on direct ink writing (DIW) technique for patterning conductive circuits on the flexible substrate. This is a promising method of fabrication for low-cost, flexible, foldable, and disposable conductors on polyimide (PI) film (or other flexible substrates). The conductive-thin electrodes can be used for electronics, micro-electro mechanical systems (MEMS), sensors, radio frequency identification devices (RFID) tags, and wireless charging coils.

Language英语
Citation statistics
Document Type会议论文
Identifierhttp://ir.sia.cn/handle/173321/22845
Collection机器人学研究室
Corresponding AuthorYu HB(于海波); Liu LQ(刘连庆)
Affiliation1.College of Information Science and Engineering, Northeastern University, Shenyang 110819, China
2.State Key Laboratory of Robotics, Chinese Academy of Sciences, Shenyang Institute of Automation, Shenyang 110016, China
Recommended Citation
GB/T 7714
Yang, Zhiwen,Yu HB,Zhou PL,et al. Fabrication of Three-dimensional Conductive Structures Using Direct Ink Writing[C]//IEEE Robotics and Automation Society. New York:IEEE,2017:1562-1565.
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