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Fabrication of Three-dimensional Conductive Structures Using Direct Ink Writing
Yang, Zhiwen1,2; Yu HB(于海波)2; Zhou PL(周培林)2; Wang JY(王敬依)2; Liu LQ(刘连庆)2
作者部门机器人学研究室
会议名称7th IEEE Annual International Conference on CYBER Technology in Automation, Control, and Intelligent Systems, CYBER 2017
会议日期July 31 - August 4, 2017
会议地点Hawaii, USA
会议主办者IEEE Robotics and Automation Society
会议录名称2017 IEEE 7th Annual International Conference on CYBER Technology in Automation, Control, and Intelligent Systems, CYBER 2017
出版者IEEE
出版地New York
2017
页码1562-1565
收录类别EI ; CPCI(ISTP)
EI收录号20183905873489
WOS记录号WOS:000447628700282
产权排序1
ISBN号978-1-5386-0489-2
关键词3d Printing Diw Flexible Mems Sensors
摘要

With the rapid development of wearable devices, the demand of flexible electronics are growing. It requires promoting the innovation of manufacturing method for the flexible electronic device. In this paper, we propose a 3D printing method based on direct ink writing (DIW) technique for patterning conductive circuits on the flexible substrate. This is a promising method of fabrication for low-cost, flexible, foldable, and disposable conductors on polyimide (PI) film (or other flexible substrates). The conductive-thin electrodes can be used for electronics, micro-electro mechanical systems (MEMS), sensors, radio frequency identification devices (RFID) tags, and wireless charging coils.

语种英语
引用统计
文献类型会议论文
条目标识符http://ir.sia.cn/handle/173321/22845
专题机器人学研究室
通讯作者Yu HB(于海波); Liu LQ(刘连庆)
作者单位1.College of Information Science and Engineering, Northeastern University, Shenyang 110819, China
2.State Key Laboratory of Robotics, Chinese Academy of Sciences, Shenyang Institute of Automation, Shenyang 110016, China
推荐引用方式
GB/T 7714
Yang, Zhiwen,Yu HB,Zhou PL,et al. Fabrication of Three-dimensional Conductive Structures Using Direct Ink Writing[C]//IEEE Robotics and Automation Society. New York:IEEE,2017:1562-1565.
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