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Modelling Industrial Cyber-Physical Systems using IEC 61499 and OPC UA
Dai, Wenbin1; Song, Yineng1; Zhang, Zhijie1; Wang P(王鹏)2; Pang, Cheng3; Vyatkin, Valeriy4,5
作者部门工业控制网络与系统研究室
会议名称16th IEEE International Conference on Industrial Informatics, INDIN 2018
会议日期July 18-20, 2018
会议地点Porto, Portugal
会议主办者IEEE Industrial Electronics Society (IES) ; INESC TE ; New University of Lisboa ; The Institute of Electrical and Electronics Engineers (IEEE)
会议录名称Proceedings - IEEE 16th International Conference on Industrial Informatics, INDIN 2018
出版者IEEE
出版地New York
2018
页码772-777
收录类别EI
EI收录号20184406000441
产权排序2
ISBN号978-1-5386-4829-2
关键词Industrial Cyber-Physical Systems Executable Modelling Language IEC 61499 Function Blocks OPC-UA Interoperability
摘要Industrial Cyber-Physical Systems (iCPS) are considered as the enabling technology for achieve Industry 4.0. One main characteristic of the iCPS is the information transparency to allow interoperability among various devices and systems. The OPC UA provides a common information model for connecting Industry 4.0 components. On the other hand, the IEC 61499 is commonly used as an executable modeling language for iCPS. The IEC 61499 function block network provides an abstract view of the system configuration. By combining IEC 61499 and OPC UA, a visual executable model for iCPS is completed. In this paper, the mapping between two standards are provided and a case study of the proposed mapping is given. © 2018 IEEE.
语种英语
文献类型会议论文
条目标识符http://ir.sia.cn/handle/173321/23434
专题工业控制网络与系统研究室
通讯作者Dai, Wenbin
作者单位1.Shanghai Jiao Tong University, China
2.Chinese Academy of Science, Shenyang Institute of Automation, China
3.Zhuxi Wisdom Valley, Jiangmen Goobotics Research Institute, Jiangmen, China
4.Lulea University of Technology, Sweden
5.Aalto University, Finland
推荐引用方式
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Dai, Wenbin,Song, Yineng,Zhang, Zhijie,et al. Modelling Industrial Cyber-Physical Systems using IEC 61499 and OPC UA[C]//IEEE Industrial Electronics Society (IES), INESC TE, New University of Lisboa, The Institute of Electrical and Electronics Engineers (IEEE). New York:IEEE,2018:772-777.
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