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A General Throughput Model for Parallel Cluster tools
Zheng XH(郑秀红)1,2,3; Yu HB(于海斌)1; Hu JT(胡静涛)1,2
Department工业信息学研究室
Conference NameInternational Colloquium on Computing, Communication, Control, and Management (CCCM 2010)
Conference DateAugest 20-22, 2010
Conference PlaceYangzhou, CHINA
Author of SourceIEEE Technol Management Council, Yangzhou Univ, Intelligent Informat Technol Appl Res Assoc, Jiangsu Comp Fed, Yangzhou Assoc Sci & Techynol
Source Publication2010 INTERNATIONAL COLLOQUIUM ON COMPUTING, COMMUNICATION, CONTROL, AND MANAGEMENT (CCCM2010), VOL I
PublisherIEEE
Publication PlaceNew York
2010
Pages341-344
Indexed ByCPCI(ISTP)
WOS IDWOS:000393717600089
Contribution Rank1
ISBN978-1-4244-7380-9
Keywordparallel cluster tools throughput model timing diagram
AbstractTo effectively evaluate and analyze performance of cluster tools in semiconductor manufacturing, the paper presents a throughput model for parallel cluster tools.For developping this model, the timing diagram is applied to describe the usage of the chamber and robot in parallel processing of cluster tools. Finally, the theoretical model which indicates the relationship between the number of chamber, processing time, transport time, and throughtput is deduced. This model can analyze and computer the wafer period and the batch period fast and accurately.
Language英语
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Document Type会议论文
Identifierhttp://ir.sia.cn/handle/173321/24116
Collection工业信息学研究室
Corresponding AuthorZheng XH(郑秀红)
Affiliation1.Key Laboratory of Industrial Informatics, Shenyang Institute of Automation, CAS, Shenyang 110016, China
2.Graduate School of the Chinese Academy of Sciences, CAS, Beijing 100039, China
3.School of Computer Science and Technology, Shenyang Institute of Chemical Technology, Shenyang, 110142, China
Recommended Citation
GB/T 7714
Zheng XH,Yu HB,Hu JT. A General Throughput Model for Parallel Cluster tools[C]//IEEE Technol Management Council, Yangzhou Univ, Intelligent Informat Technol Appl Res Assoc, Jiangsu Comp Fed, Yangzhou Assoc Sci & Techynol. New York:IEEE,2010:341-344.
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