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Semiconductor Bonding Equipment Grouping Model Based on Processing Task Matching
Gao ZJ(高治军)1; Si W(司雯)1; Han ZH(韩忠华)1,2,3,4; Peng, Jiayu1; Zheng, Hongzhi5
Department数字工厂研究室
Conference Name11th International Conference on Modelling, Identification and Control, ICMIC 2019
Conference DateJuly 13-15, 2019
Conference PlaceTianjin, China
Source PublicationProceedings of the 11th International Conference on Modelling, Identification and Control, ICMIC 2019
PublisherSpringer
Publication PlaceBerlin
2019
Pages195-204
Indexed ByEI
EI Accession number20195207924013
Contribution Rank2
ISSN1876-1100
ISBN978-981-15-0473-0
KeywordSemiconductor package line Graph theory Association matrix Device grouping
AbstractFor the problem that the fixed equipment grouping on the semiconductor packaging line cannot achieve the dynamic matching with the processing capacity of the processing task, this paper applies the graph theory method to the equipment grouping, and uses the topological structure of the graph theory to establish the equipment matrix. Also it uses the adjacency matrix to generate the relationship matrix between devices. And the device is grouped with closed position constraints and matching constraints between device types and processing types. A semiconductor bonding device grouping model based on processing task matching is established. The grouping model is simulated under different processing tasks, and it is verified that the equipment grouping model can realize dynamic grouping.
Language英语
Document Type会议论文
Identifierhttp://ir.sia.cn/handle/173321/26138
Collection数字工厂研究室
Corresponding AuthorSi W(司雯)
Affiliation1.Faculty of Information and Control Engineering, Shenyang Jianzhu University, Shenyang 110168, China
2.Department of Digital Factory, Shenyang Institute of Automation, The Chinese Academy of Sciences (CAS), Shenyang 110016, China
3.Key Laboratory of Network Control System, Chinese Academy of Sciences, Shenyang, Liaoning 110016, China
4.Institutes for Robotics and Intelligent Manufacturing, Chinese Academy of Sciences, Shenyang, Liaoning 110016, China
5.School of Mechanical Engineering, Beijing Institute of Technology Beijing, Beijing 100081, China
Recommended Citation
GB/T 7714
Gao ZJ,Si W,Han ZH,et al. Semiconductor Bonding Equipment Grouping Model Based on Processing Task Matching[C]. Berlin:Springer,2019:195-204.
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