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Dielectrophoretic batch fabrication of bundled carbon nanotube thermal sensors
Fung, C.K.M.; Wong, V.T.S.; Chan, R.H.M.; Li WJ(李文荣)
Source PublicationIEEE Transactions on Nanotechnology
Volume3Issue:3Pages:395- 403
Indexed BySCI ; EI ; CPCI(ISTP)
EI Accession number2004408394851
WOS IDWOS:000223725000010
Contribution Rank3
KeywordAc Electrophoretic Manipulation Carbon Nanotube (Cnt) Cnt Sensors Nano Batch Fabrication Nanomanufacturing
AbstractWe present a feasible technology for batch assembly of carbon nanotube (CNT) devices by utilizing ac electrophoretic technique to manipulate multiwalled bundles on an Si/SiO2 substrate. Based on this technique, CNTs were successfully and repeatably manipulated between microfabricated electrodes. By using this parallel assembly process, we have investigated the possibility of batch fabricating functional CNT devices when an ac electrical field is applied to an array of microelectrodes that are electrically connected together. Preliminary experimental results showed that over 70% of CNT functional devices can be assembled successfully using our technique, which is considered to be a good yield for nanodevices manufacturing. Besides, the devices were demonstrated to potentially serve as novel thermal sensors with low power consumption (∼microwatts) with electronic circuit response of approximately 100 kHz in constant current mode operation. In this paper, we will present the fabrication process of this feasible batch manufacturable method for functional CNT-based thermal sensors, which will dramatically reduce production costs and production time of nanosensing devices and potentially enable fully automated assembly of CNT-based devices. Experimental results from the thermal sensors fabricated by this batch process will also be discussed.
WOS HeadingsScience & Technology ; Technology ; Physical Sciences
WOS SubjectEngineering, Electrical & Electronic ; Nanoscience & Nanotechnology ; Materials Science, Multidisciplinary ; Physics, Applied
WOS Research AreaEngineering ; Science & Technology - Other Topics ; Materials Science ; Physics
Citation statistics
Cited Times:89[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Corresponding AuthorFung, C.K.M.
Affiliation1.Centre for Micro and Nano Systems, Chinese University of Hong Kong, Shatin, Hong Kong
2.Department of Mechanical Engineering, Univ. of California at Los Angeles, Los Angeles, CA 90095, United States
3.Shenyang Institute of Automation, Shenyang 110016, China
Recommended Citation
GB/T 7714
Fung, C.K.M.,Wong, V.T.S.,Chan, R.H.M.,et al. Dielectrophoretic batch fabrication of bundled carbon nanotube thermal sensors[J]. IEEE Transactions on Nanotechnology,2004,3(3):395- 403.
APA Fung, C.K.M.,Wong, V.T.S.,Chan, R.H.M.,&Li WJ.(2004).Dielectrophoretic batch fabrication of bundled carbon nanotube thermal sensors.IEEE Transactions on Nanotechnology,3(3),395- 403.
MLA Fung, C.K.M.,et al."Dielectrophoretic batch fabrication of bundled carbon nanotube thermal sensors".IEEE Transactions on Nanotechnology 3.3(2004):395- 403.
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