| Dielectrophoretic batch fabrication of bundled carbon nanotube thermal sensors | |
Fung, C.K.M.; Wong, V.T.S.; Chan, R.H.M.; Li WJ(李文荣)
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| Department | 机器人学研究室 |
| Source Publication | IEEE Transactions on Nanotechnology
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| ISSN | 1536-125X |
| 2004 | |
| Volume | 3Issue:3Pages:395- 403 |
| Indexed By | SCI ; EI ; CPCI（ISTP） |
| EI Accession number | 2004408394851 |
| WOS ID | WOS:000223725000010 |
| Contribution Rank | 3 |
| Keyword | Ac Electrophoretic Manipulation Carbon Nanotube (Cnt) Cnt Sensors Nano Batch Fabrication Nanomanufacturing |
| Abstract | We present a feasible technology for batch assembly of carbon nanotube (CNT) devices by utilizing ac electrophoretic technique to manipulate multiwalled bundles on an Si/SiO2 substrate. Based on this technique, CNTs were successfully and repeatably manipulated between microfabricated electrodes. By using this parallel assembly process, we have investigated the possibility of batch fabricating functional CNT devices when an ac electrical field is applied to an array of microelectrodes that are electrically connected together. Preliminary experimental results showed that over 70% of CNT functional devices can be assembled successfully using our technique, which is considered to be a good yield for nanodevices manufacturing. Besides, the devices were demonstrated to potentially serve as novel thermal sensors with low power consumption (∼microwatts) with electronic circuit response of approximately 100 kHz in constant current mode operation. In this paper, we will present the fabrication process of this feasible batch manufacturable method for functional CNT-based thermal sensors, which will dramatically reduce production costs and production time of nanosensing devices and potentially enable fully automated assembly of CNT-based devices. Experimental results from the thermal sensors fabricated by this batch process will also be discussed. |
| Language | 英语 |
| WOS Headings | Science & Technology ; Technology ; Physical Sciences |
| WOS Subject | Engineering, Electrical & Electronic ; Nanoscience & Nanotechnology ; Materials Science, Multidisciplinary ; Physics, Applied |
| WOS Keyword | SHEAR-STRESS SENSOR ; ELECTRICAL-CONDUCTIVITY ; AC ELECTROPHORESIS ; CONTACT RESISTANCE ; OHMIC CONTACTS ; PURIFICATION ; ORIENTATION ; PLACEMENT ; ARRAYS ; METAL |
| WOS Research Area | Engineering ; Science & Technology - Other Topics ; Materials Science ; Physics |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.sia.cn/handle/173321/7345 |
| Collection | 机器人学研究室 |
| Corresponding Author | Fung, C.K.M. |
| Affiliation | 1.Centre for Micro and Nano Systems, Chinese University of Hong Kong, Shatin, Hong Kong 2.Department of Mechanical Engineering, Univ. of California at Los Angeles, Los Angeles, CA 90095, United States 3.Shenyang Institute of Automation, Shenyang 110016, China |
| Recommended Citation GB/T 7714 | Fung, C.K.M.,Wong, V.T.S.,Chan, R.H.M.,et al. Dielectrophoretic batch fabrication of bundled carbon nanotube thermal sensors[J]. IEEE Transactions on Nanotechnology,2004,3(3):395- 403. |
| APA | Fung, C.K.M.,Wong, V.T.S.,Chan, R.H.M.,&Li WJ.(2004).Dielectrophoretic batch fabrication of bundled carbon nanotube thermal sensors.IEEE Transactions on Nanotechnology,3(3),395- 403. |
| MLA | Fung, C.K.M.,et al."Dielectrophoretic batch fabrication of bundled carbon nanotube thermal sensors".IEEE Transactions on Nanotechnology 3.3(2004):395- 403. |
| Files in This Item: | ||||||
| File Name/Size | DocType | Version | Access | License | ||
| YWQK000131.pdf（752KB） | 期刊论文 | 出版稿 | 开放获取 | ODC PDDL | View Application Full Text | |
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