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Development of a novel parallel manipulator based machine tool
Chen WJ(陈文家); Zhao MY(赵明扬); Fang LJ(房立金); Xu ZG(徐志刚)
Department机器人学研究室
Conference Name4th World Congress on Intelligent Control and Automation
Conference DateJune 10-14, 2002
Conference PlaceSHANGHAI, China
Author of SourceTongji Univ, Shanghai Jiaotong Univ, E China Univ Sci & Technol, IEEE Robot & Automat Soc, IEEE Control Syst Soc, Beijing Chapter, Chinese Assoc Automat, Shanghai Assoc Automat
Source PublicationPROCEEDINGS OF THE 4TH WORLD CONGRESS ON INTELLIGENT CONTROL AND AUTOMATION, VOLS 1-4
PublisherIEEE
Publication PlaceNEW YORK
2002
Pages895-899
Indexed ByEI ; CPCI(ISTP)
EI Accession number2003047336552
WOS IDWOS:000179017500191
Contribution Rank1
ISBN0-7803-7268-9
AbstractA new type of 5-axis parallel machine tool based on a novel 4 degrees of freedom hybrid parallel platform manipulator with base mounted prismatic actuators is presented. This machine tool is different from the Stewart platform type parallel machine tool in that its feed motion in X-direction is realized by the worktable on which work-piece is fixed instead of the movable platform of the manipulator. Due to this special architecture, the workspace in X-direction of the new machine tool is enlarged greatly. And its rigidity is higher because of the adaptation of gantry structure. This machine tool is controlled by a PC based NC system in simultaneous 5 axes control mode.
Language英语
Citation statistics
Cited Times:1[WOS]   [WOS Record]     [Related Records in WOS]
Document Type会议论文
Identifierhttp://ir.sia.cn/handle/173321/8655
Collection机器人学研究室
AffiliationRobotics Laboratory, Shenyang Institute of Automation, Chinese Academy of Sciences, 114 Nanta Street, Shenyang 110016, China
Recommended Citation
GB/T 7714
Chen WJ,Zhao MY,Fang LJ,et al. Development of a novel parallel manipulator based machine tool[C]//Tongji Univ, Shanghai Jiaotong Univ, E China Univ Sci & Technol, IEEE Robot & Automat Soc, IEEE Control Syst Soc, Beijing Chapter, Chinese Assoc Automat, Shanghai Assoc Automat. NEW YORK:IEEE,2002:895-899.
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