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Wafer level approaches for the integration of carbon nanotubes in electronic and sensor applications
Hermann, Sascha; Fiedler, Holge; Yu HB(于海波); Loschek, Serge; Bonitz, Jens; Schulz, Stefan E.; Gessner, Thomas
作者部门机器人学研究室
会议名称9th International Multi-Conference on Systems, Signals and Devices, SSD 2012
会议日期March 20-23, 2012
会议地点Chemnitz, Germany
会议录名称International Multi-Conference on Systems, Signals and Devices, SSD 2012 - Summary Proceedings
出版者IEEE Computer Society
出版地Piscataway, NJ
2012
页码5 pp.
收录类别EI
EI收录号20122315082453
产权排序2
ISBN号978-1-4673-1590-6
关键词Chemical Vapor Deposition Optical Interconnects Sensors
摘要In this work we give an overview about recent developments in the integration technology of CNTs. We focus on wafer level approaches with the CVD and DEP method for growing as well as depositing CNTs in a defined way. So that we present methods to manipulate CNT growth structure, growth mode as well as growth inhibition in thermal CVD processes. This is highlighted by a unique growth structure opening new possibilities for CNT integration. Likewise, we show recent developments in scaling up the DEP method on wafer level. We round it up with the fabrication of CNT vias and MEMS structures containing CNT sensor elements.
语种英语
文献类型会议论文
条目标识符http://ir.sia.cn/handle/173321/9879
专题机器人学研究室
作者单位1.Chemnitz University of Technology, Center for Microtechnologies (ZfM), 09126 Chemnitz, Germany
2.Robotics Laboratory, Shenyang Institute of Automation, Chinese Academy of Sciences, 110016 Shenyang, China
3.Fraunhofer Institute for Electronic Nano Systems (ENAS), 09126 Chemnitz, Germany
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Hermann, Sascha,Fiedler, Holge,Yu HB,et al. Wafer level approaches for the integration of carbon nanotubes in electronic and sensor applications[C]. Piscataway, NJ:IEEE Computer Society,2012:5 pp..
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