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Wafer level approaches for the integration of carbon nanotubes in electronic and sensor applications
Hermann, Sascha; Fiedler, Holge; Yu HB(于海波); Loschek, Serge; Bonitz, Jens; Schulz, Stefan E.; Gessner, Thomas
Department机器人学研究室
Conference Name9th International Multi-Conference on Systems, Signals and Devices, SSD 2012
Conference DateMarch 20-23, 2012
Conference PlaceChemnitz, Germany
Source PublicationInternational Multi-Conference on Systems, Signals and Devices, SSD 2012 - Summary Proceedings
PublisherIEEE Computer Society
Publication PlacePiscataway, NJ
2012
Pages5 pp.
Indexed ByEI
EI Accession number20122315082453
Contribution Rank2
ISBN978-1-4673-1590-6
KeywordChemical Vapor Deposition Optical Interconnects Sensors
AbstractIn this work we give an overview about recent developments in the integration technology of CNTs. We focus on wafer level approaches with the CVD and DEP method for growing as well as depositing CNTs in a defined way. So that we present methods to manipulate CNT growth structure, growth mode as well as growth inhibition in thermal CVD processes. This is highlighted by a unique growth structure opening new possibilities for CNT integration. Likewise, we show recent developments in scaling up the DEP method on wafer level. We round it up with the fabrication of CNT vias and MEMS structures containing CNT sensor elements.
Language英语
Document Type会议论文
Identifierhttp://ir.sia.cn/handle/173321/9879
Collection机器人学研究室
Affiliation1.Chemnitz University of Technology, Center for Microtechnologies (ZfM), 09126 Chemnitz, Germany
2.Robotics Laboratory, Shenyang Institute of Automation, Chinese Academy of Sciences, 110016 Shenyang, China
3.Fraunhofer Institute for Electronic Nano Systems (ENAS), 09126 Chemnitz, Germany
Recommended Citation
GB/T 7714
Hermann, Sascha,Fiedler, Holge,Yu HB,et al. Wafer level approaches for the integration of carbon nanotubes in electronic and sensor applications[C]. Piscataway, NJ:IEEE Computer Society,2012:5 pp..
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