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Alternative TitleAnalysis of Airflow Parameters of Wet Etching Chamber Based on Logistic Regression Model
王靖震; 刘伟军
Source Publication机械设计与制造
Contribution Rank1
Funding Organization国家科技重大专项极大规模集成电路制造装备及成套工艺资助项目(2009ZX02008-003)
KeywordLogistic回归模型 正交试验设计 湿法刻蚀 气流场
Other AbstractIn the wet etching chamber,vortex need to be avoided in the airflow field so that the micro-particles in the airflow field can flow smoothly out of the wet etching chamber,and then the pollution degree on the wafer surface can be reduced.For the purpose of avoiding the vortex,the simulation software FLUNET and the method of orthogonal design of experiment was used to obtain the airflow field distribution of wet etching chamber under different process parameters.Then a Logistic regression model was obtained based on these airflow field simulation data.Test proven that the calculation result of the regression model is consistent with the result of simulation.So,the obtained Logistic regression model can help us to select wet etching process parameters as a useful reference. 更多
Document Type期刊论文
Recommended Citation
GB/T 7714
王靖震,刘伟军. 基于Logistic回归的湿法刻蚀腔体气流场参数分析[J]. 机械设计与制造,2012(6):223-225.
APA 王靖震,&刘伟军.(2012).基于Logistic回归的湿法刻蚀腔体气流场参数分析.机械设计与制造(6),223-225.
MLA 王靖震,et al."基于Logistic回归的湿法刻蚀腔体气流场参数分析".机械设计与制造 .6(2012):223-225.
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