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基于Logistic回归的湿法刻蚀腔体气流场参数分析
Alternative TitleAnalysis of Airflow Parameters of Wet Etching Chamber Based on Logistic Regression Model
王靖震; 刘伟军
Department装备制造技术研究室
Source Publication机械设计与制造
ISSN1001-3997
2012
Issue6Pages:223-225
Contribution Rank1
Funding Organization国家科技重大专项极大规模集成电路制造装备及成套工艺资助项目(2009ZX02008-003)
KeywordLogistic回归模型 正交试验设计 湿法刻蚀 气流场
Abstract在湿法刻蚀腔体中,为使气流场中的微颗粒物顺畅的流出刻蚀腔体,减小对晶圆片的微粒污染程度,应该避免气流场中产生涡流。针对避免在气流场中产生涡流这一问题,应用FLUENT仿真模拟软件,通过使用正交试验设计的方法,得到不同工艺参数情况下的湿法刻蚀腔体气流场分布情况。然后对仿真结果数据进行Logistic回归建模。Logistic回归模型计算结果与仿真结果有较高的一致性。Logistic回归模型对湿法刻蚀工艺参数的选择具有指导意义。
Other AbstractIn the wet etching chamber,vortex need to be avoided in the airflow field so that the micro-particles in the airflow field can flow smoothly out of the wet etching chamber,and then the pollution degree on the wafer surface can be reduced.For the purpose of avoiding the vortex,the simulation software FLUNET and the method of orthogonal design of experiment was used to obtain the airflow field distribution of wet etching chamber under different process parameters.Then a Logistic regression model was obtained based on these airflow field simulation data.Test proven that the calculation result of the regression model is consistent with the result of simulation.So,the obtained Logistic regression model can help us to select wet etching process parameters as a useful reference. 更多
Language中文
Document Type期刊论文
Identifierhttp://ir.sia.cn/handle/173321/9937
Collection智能产线与系统研究室
Affiliation1.中国科学院沈阳自动化研究所
2.中国科学院研究生院
Recommended Citation
GB/T 7714
王靖震,刘伟军. 基于Logistic回归的湿法刻蚀腔体气流场参数分析[J]. 机械设计与制造,2012(6):223-225.
APA 王靖震,&刘伟军.(2012).基于Logistic回归的湿法刻蚀腔体气流场参数分析.机械设计与制造(6),223-225.
MLA 王靖震,et al."基于Logistic回归的湿法刻蚀腔体气流场参数分析".机械设计与制造 .6(2012):223-225.
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