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Grouping Method of Semiconductor Bonding Equipment Based on Clustering by Fast Search and Find of Density Peaks for Dynamic Matching According to Processing Tasks 期刊论文
PROCESSES, 2019, 卷号: 7, 期号: 9, 页码: 1-24
Authors:  Gao ZJ(高治军);  Si W(司雯);  Han ZH(韩忠华);  Peng, Jiayu;  Qiao, Feng
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semiconductor bonding equipment-grouping method  graph theory  association matrix  CFSFDP algorithm